Basics of microelectronics manufacturing processes
Descripción
The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to research into design tools, processes, and design automation. The manufacturing process involves not only the most common manufacturing steps like deposition, photoresist, lithography, etch, ionization, and packaging, but also measurement and inspection, testing, and much more.
This course introduces the microelectronics manufacturing processes commonly used in chip mass production, from the fabrication of a silicon wafer to the packaging process, and focuses on the complex high-technology machinery needed to achieve work in this nanoworld. Students will learn the state of the art and future challenges in manufacturing and measurement. Theoretical and practical aspects will be introduced to get a complete technical overview of the manufacturing processes.
The course is divided in four main modules, composed of several short videos with a practiced-oriented design, which facilitates the acquisition of knowledge.
El curso tiene como objetivo adquirir los siguientes conocimientos:
LO1 – understand microelectronics technology and materials required to manufacture an integrated circuit.
LO2 – understand and be able to define microelectronic processes required to manufacture an integrated circuit.
LO3 – understand and identify microelectronic tools.
LO4 – understand and identify machinery, ancillary processes, and utilities that apply to a microelectronics factory.
LO5 – understand and identify standards, patents, and regulations that apply to a microelectronics factory.
This course introduces the microelectronics manufacturing processes commonly used in chip mass production, from the fabrication of a silicon wafer to the packaging process, and focuses on the complex high-technology machinery needed to achieve work in this nanoworld. Students will learn the state of the art and future challenges in manufacturing and measurement. Theoretical and practical aspects will be introduced to get a complete technical overview of the manufacturing processes.
The course is divided in four main modules, composed of several short videos with a practiced-oriented design, which facilitates the acquisition of knowledge.
El curso tiene como objetivo adquirir los siguientes conocimientos:
LO1 – understand microelectronics technology and materials required to manufacture an integrated circuit.
LO2 – understand and be able to define microelectronic processes required to manufacture an integrated circuit.
LO3 – understand and identify microelectronic tools.
LO4 – understand and identify machinery, ancillary processes, and utilities that apply to a microelectronics factory.
LO5 – understand and identify standards, patents, and regulations that apply to a microelectronics factory.
Información del curso
Curso
Fechas02/09/2024 - 31/12/2026
Duración (nº horas)250,0
Horario
A tu ritmo, formación accesible 365 días al año
FormatoOn-Line
Localización
A través de la plataforma Moodle del proyecto ECOVEN
http://ecovem.ieectqai.uned.es/moodle2/
http://ecovem.ieectqai.uned.es/moodle2/
IdiomaInglés
Plazas disponibles0/50
Titulaciónown:Equivalencia EQF4 - EQF5 = 10 ECTS
Coste
Gratuito
Este curso ha sido desarrollado gracias al proyecto ECoVEM European Center of Vocational Excellence in Microelectronics - nº 620101-EPP-1-2020-1-BG-EPPKA3-VET-COVE.
Ofrecido por
